Media OutReach

Media OutReach

Toray Engineering: Launch of UC5000 Semiconductor Packaging Equipment Compatible with Large Glass Panels

High-accuracy packaging in panel level packaging TOKYO, JAPAN – Media OutReach Newswire – 27 March 2025 – Toray Engineering Co., Ltd.,has developed the UC5000, a high-accuracy semiconductor packaging equipment (bonder) for panel level packaging “PLP”. PLP is an advanced semiconductor packaging technology, for which there is growing demand particularly from […]

Leng Aik Engineering Launches Advanced DfMA Factory For Prefab MEP Systems

Developed with the support of Building and Construction Authority (“BCA”) and A*STAR Singapore Institute of Manufacturing Technology (“A*STAR SIMTech”), the factory utilises automation, robotics and AR technologies to improve quality control, efficiency, safety and accuracy. SINGAPORE – Media OutReach Newswire – 27 March 2025 – Leng Aik Engineering Pte Ltd […]